NTD3055L170-001【PDF 1/8 页】MOSFET N-CH 60V 9A IPAK

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NTD3055L170,

NVD3055L170

Power MOSFET

9.0 A, 60 V, Logic Level, N ? Channel DPAK

Designed for low voltage, high speed switching applications in

power supplies, converters and power motor controls and bridge

circuits.

Features

? NVD Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC ? Q101

Qualified and PPAP Capable

? These are Pb ? Free Devices

http://onsemi.com

9.0 AMPERES, 60 VOLTS

R DS(on) = 170 m W

N ? Channel

Typical Applications

? Power Supplies

? Converters

? Power Motor Controls

? Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

DPAK

Rating

Drain ? to ? Source Voltage

Drain ? to ? Gate Voltage (R GS = 10 M W )

Symbol

V DSS

V DGR

Value

Unit

Vdc

1 2

CASE 369C

(Surface Mounted)

STYLE 2

Gate ? to ? Source Voltage

? Continuous

? Non ? repetitive (t p v 10 ms)

Drain Current

? Continuous @ T A = 25 ° C

? Continuous @ T A = 100 ° C

? Single Pulse (t p v 10 m s)

V GS

I D

I DM

" 15

" 20

9.0

3.0

Vdc

Adc

Apk

DPAK ? 3

CASE 369D

(Straight Lead)

STYLE 2

YWW

Drain

3 ? Source

YWW

Drain

3 ? Source

Total Power Dissipation @ T A = 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 1)

Total Power Dissipation @ T A = 25 ° C (Note 2)

Operating and Storage Temperature Range

Single Pulse Drain ? to ? Source Avalanche

Energy ? Starting T J = 25 ° C

(V DD = 25 Vdc, V GS = 5.0 Vdc,

L = 1.0 mH, I L (pk) = 7.75 A, V DS = 60 Vdc)

Thermal Resistance

? Junction ? to ? Case

? Junction ? to ? Ambient (Note 1)

? Junction ? to ? Ambient (Note 2)

P D

T J , T stg

E AS

R q JC

R q JA

28.5

0.19

2.1

1.5

? 55 to

175

5.2

71.4

100

W/ ° C

° C

° C/W

MARKING DIAGRAMS

1 ? Gate

2 ? Drain 31

70LG

1 ? Gate

2 ? Drain 31

70LG

Maximum Lead Temperature for Soldering T L 260 ° C

Purposes, 1/8 ″ from case for 10 seconds

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommen-

ded Operating Conditions is not implied. Extended exposure to stresses above

the Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using 0.5 sq in pad size.

2. When surface mounted to an FR4 board using minimum recommended

pad size.

A = Assembly Location

Y = Year

WW = Work Week

3170L = Device Code

G = Pb ? Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

? Semiconductor Components Industries, LLC, 2012

June, 2012 ? Rev. 5

Publication Order Number:

NTD3055L170/D

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